Оглавление
George Domingo. Semiconductor Basics
Table of Contents
List of Tables
List of Illustrations
Guide
Pages
Semiconductor Basics. A Qualitative, Non‐mathematical Explanation of How Semiconductors Work and How They Are Used
Acknowledgements
Introduction
1 The Bohr Atom. OBJECTIVES OF THIS CHAPTER
1.1 Sinusoidal Waves
1.2 The Case of the Missing Lines
1.3 The Strange Behavior of Spectra from Gases and Metals
1.4 The Classifications of Basic Elements
1.5 The Hydrogen Spectrum Lines
1.6 Light is a Particle
1.7 The Atom's Structure
1.8 The Bohr Atom
1.9 Summary and Conclusions
Appendix 1.1 Some Details of the Bohr Model
Appendix 1.2 Semiconductor Materials
Appendix 1.3 Calculating the Rydberg Constant
2 Energy Bands. OBJECTIVES OF THIS CHAPTER
2.1 Bringing Atoms Together
2.2 The Insulator
2.3 The Conductor
2.4 The Semiconductor
2.5 Digression: Water Analogy
2.6 The Mobility of Charges
2.7 Summary and Conclusions
Appendix 2.1 Energy Gap in Semiconductors
Appendix 2.2 Number of Electrons and the Fermi Function
3 Types of Semiconductors. OBJECTIVES OF THIS CHAPTER
3.1 Semiconductor Materials
3.2 Short Summary of Semiconductor Materials. 3.2.1 Silicon
3.2.2 Germanium
3.2.3 Gallium Arsenide
3.3 Intrinsic Semiconductors
3.4 Doped Semiconductors: n‐Type
3.5 Doped Semiconductors: p‐Type
3.6 Additional Considerations
3.7 Summary and Conclusions
Appendix 3.1 The Fermi Levels in Doped Semiconductors
Appendix 3.2 Why All Donor Electrons go to the Conduction Band
4 Infrared Detectors. OBJECTIVES OF THIS CHAPTER
4.1 What is Infrared Radiation?
4.2 What Our Eyes Can See
4.3 Infrared Applications
4.4 Types of Infrared Radiation
4.5 Extrinsic Silicon Infrared Detectors
4.6 Intrinsic Infrared Detectors
4.7 Summary and Conclusions
Appendix 4.1 Light Diffraction
Appendix 4.2 Blackbody Radiation
5 The pn‐Junction. OBJECTIVES OF THIS CHAPTER
5.1 The pn‐Junction
5.2 The Semiconductor Diode
5.3 The Schottky Diode
5.4 The Zener or Tunnel Diode
5.5 Summary and Conclusions
Appendix 5.1 Fermi Levels of a pn‐Junction
Appendix 5.2 Diffusion and Drift Currents
Appendix 5.3 The Thickness of the Transition Region
Appendix 5.4 Work Function and the Schottky Diode
6 Other Electrical Components. OBJECTIVES OF THIS CHAPTER
6.1 Voltage and Current
6.2 Resistance
6.3 The Capacitor
6.4 The Inductor
6.5 Sinusoidal Voltage
6.6 Inductor Applications
6.7 Summary and Conclusions
Appendix 6.1 Impedance and Phase Changes
7 Diode Applications. OBJECTIVES OF THIS CHAPTER
7.1 Solar Cells
7.2 Rectifiers
7.3 Current Protection Circuit
7.4 Clamping Circuit
7.5 Voltage Clipper
7.6 Half‐wave Voltage Doubler
7.7 Solar Cells Bypass Diodes
7.8 Applications of Schottky Diodes
7.9 Applications of Zener Diodes
7.10 Summary and Conclusions
Appendix 7.1 Calculation of the Current Through an RC Circuit
8 Transistors. OBJECTIVES OF THIS CHAPTER
8.1 The Concept of the Transistor
8.2 The Bipolar Junction Transistor
8.3 The Junction Field‐effect Transistor
8.4 The Metal Oxide Semiconductor FET
8.5 Summary and Conclusions
Appendix 8.1 Punch Trough
9 Transistor Biasing Circuits. OBJECTIVES OF THIS CHAPTER
9.1 Introduction
9.2 Emitter Feedback Bias
9.3 Sinusoidal Operation of a Transistor with Emitter Bias
9.4 The Fixed Bias Circuit
9.5 The Collector Feedback Bias Circuit
9.6 Power Considerations
9.7 Multistage Transistor Amplifiers
9.8 Operational Amplifiers
9.9 The Ideal OpAmp
9.10 Summary and Conclusions
Appendix 9.1 Derivation of the Stability of the Collector Feedback Circuit
10 Integrated Circuit Fabrication. OBJECTIVES OF THIS CHAPTER
10.1 The Basic Material
10.2 The Boule
10.2.1 The Czochralski Method
10.2.2 The Flow‐zone Method
10.3 Wafers and Epitaxial Growth
10.4 Photolithography
10.5 The Fabrication of a pnp Transistor on a Silicon Wafer
10.6 A Digression on Doping
10.6.1 Thermal Diffusion
10.6.2 Implantation
10.7 Resume the Transistor Processing
10.7.1 The Contacts
10.7.2 Metallization
10.7.3 Multiple Interconnects
10.8 Fabrication of Other Components
10.8.1 The Integrated Resistor
10.8.2 The Integrated Capacitor
10.8.3 The Integrated Inductor
10.9 Testing and Packaging
10.10 Clean Rooms
10.11 Additional Thoughts About Processing
10.12 Summary and Conclusions
Appendix 10.1 Miller Indices in the Diamond Structure
11 Logic Circuits. OBJECTIVES OF THIS CHAPTER
11.1 Boolean Algebra
11.2 Logic Symbols and Relay Circuits
11.3 The Electronics Inside the Symbols
11.3.1 Diode Implementation
11.3.2 CMOS Implementation
11.4 The Inverter or NOT Circuit
11.5 The NOR Circuit
11.6 The NAND Circuit
11.7 The XNOR or Exclusive NOR
11.8 The Half Adder
11.9 The Full Adder
11.10 Adding More than Two Digital Numbers
11.11 The Subtractor
11.12 Digression: Flip‐flops, Latches, and Shifters
11.13 Multiplication and Division of Binary Numbers
11.14 Additional Comments: Speed and Power
11.15 Summary and Conclusions
Appendix 11.1 Algebraic Formulation of Logic Modules
Appendix 11.2 Detailed Analysis of the Full Adder
Appendix 11.3 Complementary Numbers
Appendix 11.4 Dividing Digital Numbers
Appendix 11.5 The Author’s Symbolic Logic Machine Using Relays
12 VLSI Components. OBJECTIVES OF THIS CHAPTER
12.1 Multiplexers
12.2 Demultiplexers
12.3 Registers
12.4 Timing and Waveforms
12.5 Memories
12.5.1 Static Random‐access Memory
12.5.2 Dynamic Random‐access Memory
12.5.3 Read‐only Memory
12.5.4 Programable Read‐only Memory
12.6 Gate Arrays
12.7 Summary and Conclusions
Appendix 12.1 A NAND implementation of a 2 to 1 MUX
13 Optoelectronics. OBJECTIVES OF THIS CHAPTER
13.1 Photoconductors
13.2 PIN Diodes
13.3 LASERs. 13.3.1 Laser Action
13.3.2 Solid‐state Lasers
13.3.3 Semiconductor LASERs
13.3.4 LASER Applications
13.4 Light‐emitting Diodes
13.5 Summary and Conclusions
Appendix 13.1 The Detector Readout
14 Microprocessors and Modern Electronics. OBJECTIVES OF THIS CHAPTER
14.1 The Computer. 14.1.1 Computer Architecture
14.1.2 Memories
14.1.3 Input and Output Units
14.1.4 The Central Processing Unit
14.2 Microcontrollers
14.3 Liquid Crystal Displays
14.3.1 Liquid Crystal Materials
14.3.2 Contacts
14.3.3 Color Filters
14.3.4 Thin‐film Transistors
14.3.5 The Glass
14.3.6 Polarizers
14.3.7 The Source of Light
14.3.8 The Entire Operation
14.4 Summary and Conclusions
Appendix 14.1 Keyboard Codes
15 The Future. OBJECTIVES OF THIS CHAPTER
15.1 The Past
15.2 Problems with Silicon‐based Technology
15.3 New Technologies
15.3.1 Nanotubes
15.3.2 Quantum Computing
15.3.3 Biocomputing
15.4 Silicon Technology Innovations
15.4.1 Process Improvements
15.4.2 Vertical Integration
15.4.3 The FinFET
15.4.4 The Tunnel FET
15.5 Summary and Conclusions
Epilogue
Appendix A Useful Constants. A.1 Fundamental Physical Constants
A.2 Basic Units
A.3 Derived Units
Appendix B. Properties of Silicon
Appendix C List of Acronyms. A
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Greek letters
Additional Reading and Sources
Index
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