Extrinsic and Intrinsic Approaches to Self-Healing Polymers and Polymer Composites

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Ming Qiu Zhang. Extrinsic and Intrinsic Approaches to Self-Healing Polymers and Polymer Composites

Table of Contents

List of Tables

List of Illustrations

Guide

Pages

Extrinsic and Intrinsic Approaches to Self‐Healing Polymers and Polymer Composites

Preface

1 Basics of Self‐Healing – State of the Art. CHAPTER MENU

1.1 Background

1.1.1 Adhesive Bonding for Healing Thermosetting Materials

1.1.2 Fusion Bonding for Healing Thermoplastic Materials

1.1.3 Bioinspired Self‐Healing

1.2 Intrinsic Self‐Healing

1.2.1 Self‐Healing Based on Reversible Covalent Chemistry

1.2.1.1 Healing Based on General Reversible Covalent Reactions. Thermally Reversible Cycloaddition

Photoreversible Cycloaddition

Hydrolysis‐Bonding Equilibrium

1.2.1.2 Healing Based on Dynamic Reversible Covalent Reactions. Exchange Reaction of Disulfide Bonds

Exchange Reaction of C═N Bonds

Transesterification

Miscellaneous

1.2.2 Self‐Healing Based on Supramolecular Interactions

1.2.2.1 Coordination Bonds

1.2.2.2 Ionic Associations

1.2.2.3 Hydrogen Bonds

1.2.2.4 Other Intermolecular Forces

1.2.2.5 Host–Guest Inclusion

1.3 Extrinsic Self‐Healing

1.3.1 Self‐Healing in Terms of Healant Loaded Pipelines. 1.3.1.1 Hollow Tubes and Fibers

1.3.1.2 Three‐Dimensional Microvascular Networks

1.3.2 Self‐Healing in Terms of Healant Loaded Microcapsules

1.3.2.1 Methods of Microencapsulation

In‐Situ Polymerization

Interfacial Polymerization

Pickering Emulsion Templating

Miniemulsion Polymerization

Solvent Evaporation/Solvent Extraction

Sol–Gel Reaction

1.3.2.2 Healing Chemistries

Ring‐Opening Metathesis Polymerization

Polycondensation

Free Radical Polymerization

Addition Reaction

1.4 Insights for Future Work

References

2 Extrinsic Self‐Healing via Addition Polymerization. CHAPTER MENU

2.1 Design and Selection of Healing System

2.2 Microencapsulation of Mercaptan and Epoxy by In‐Situ Polymerization. 2.2.1 Microencapsulation of Mercaptan

2.2.2 Microencapsulation of Epoxy

2.3 Filling Polymeric Tubes with Mercaptan and Epoxy

2.4 Characterization of Self‐Healing Functionality

2.4.1 Self‐Healing Epoxy Materials with Embedded Dual Encapsulated Healant – Healing of Crack Due to Monotonic Fracture

2.4.2 Factors Related to Performance Improvement

2.4.3 Self‐Healing Epoxy Materials with Embedded Dual Encapsulated Healant – Healing of Fatigue Crack

2.4.4 Self‐Healing Epoxy/Glass Fabric Composites with Embedded Dual Encapsulated Healant – Healing of Impact Damage

2.4.5 Self‐Healing Epoxy/Glass Fabric Composites with Self‐Pressurized Healing System

2.5 Concluding Remarks

References

3 Extrinsic Self‐Healing Via Cationic Polymerization. CHAPTER MENU

3.1 Thermosetting

3.1.1 Microencapsulation of Epoxy by Ultraviolet Irradiation‐Induced Interfacial Copolymerization

3.1.2 Encapsulation of Boron‐Containing Curing Agent

3.1.2.1 Loading Boron‐Containing Curing Agent onto Porous Media

3.1.2.2 Microencapsulation of Boron‐Containing Curing Agent Via the Hollow Capsules Approach

3.1.3 Characterization of Self‐Healing Functionality

3.1.3.1 Self‐Healing Epoxy Materials with Embedded Epoxy‐Loaded Microcapsules and (C2H5)2O·BF3‐Loaded Sisal

3.1.3.2 Self‐Healing Epoxy Materials with Embedded Dual Encapsulated Healant

3.1.4 Preparation of Silica Walled Microcapsules Containing SbF5·HOC2H5/HOC2H5

3.1.5 Self‐Healing Epoxy Materials with Embedded Epoxy‐Loaded Microcapsules and SbF5·HOC2H5/HOC2H5‐Loaded Silica Capsules

3.1.6 Preparation of Silica Walled Microcapsules Containing TfOH

3.1.7 Self‐Healing Epoxy Materials with Embedded Epoxy‐Loaded Microcapsules and TfOH‐Loaded Silica Capsules

3.2 Thermoplastics. 3.2.1 Preparation of IBH/GMA‐Loaded Microcapsules

3.2.2 Self‐Healing PS Composites Filled with IBH/GMA‐Loaded Microcapsules and NaBH4 Particles

3.3 Concluding Remarks

References

4 Extrinsic Self‐Healing via Anionic Polymerization. CHAPTER MENU

4.1 Preparation of Epoxy‐Loaded Microcapsules and Latent Hardener. 4.1.1 Microencapsulation of Epoxy by In‐Situ Condensation

4.1.2 Preparation of Imidazole Latent Hardener

4.2 Self‐Healing Epoxy Materials with Embedded Epoxy‐Loaded Microcapsules and Latent Hardener

4.3 Self‐Healing Epoxy/Woven Glass Fabric Composites with Embedded Epoxy‐Loaded Microcapsules and Latent Hardener – Healing of Interlaminar Failure

4.4 Durability of Healing Ability

4.5 Self‐Healing Epoxy/Woven Glass Fabric Composites with Embedded Epoxy‐Loaded Microcapsules and Latent Hardener – Healing of Impact Damage

4.6 Concluding Remarks

References

5 Extrinsic Self‐Healing Via Miscellaneous Reactions. CHAPTER MENU

5.1 Extrinsic Self‐Healing Via Nucleophilic Addition and Ring‐Opening Reactions

5.1.1 Microencapsulation of GMA by In‐Situ Polymerization

5.1.2 Self‐Healing Epoxy Materials with Embedded Single‐Component Healant

5.2 Extrinsic Self‐Healing Via Living Polymerization

5.2.1 Preparation of Living PMMA and Its Composites with GMA‐Loaded Microcapsules

5.2.2 Self‐Healing Performance of Living PMMA Composites Filled with GMA‐Loaded Microcapsules

5.2.3 Preparation of GMA‐Loaded Multilayered Microcapsules and their PS‐Based Composites

5.2.4 Self‐Healing Performance of PS Composites Filled with GMA‐Loaded Multilayered Microcapsules

5.3 Extrinsic Self‐Healing Via Free Radical Polymerization

5.3.1 Microencapsulation of Styrene and BPO

5.3.2 Self‐Healing Performance of Epoxy Composites Filled with Dual Capsules

5.4 Concluding Remarks

References

6 Intrinsic Self‐Healing Via the Diels–Alder Reaction. CHAPTER MENU

6.1 Molecular Design and Synthesis

6.1.1 Synthesis of DGFA

6.1.2 Reversibility of DA Bonds and Crack Remendability of DGFA‐Based Polymer

6.1.3 Synthesis and Characterization of FGE

6.1.4 Reversibility of DA Bonds and Crack Remendability of FGE‐Based Polymer

6.2 Blends of DGFA and FGE

6.2.1 Reversibility of DA Bonds

6.2.2 Crack Remendability of Cured DGFA/FGE Blends

6.3 Concluding Remarks

References

7 Intrinsic Self‐Healing Via Synchronous Fission/Radical Recombinationof the C─ON Bond. CHAPTER MENU

7.1 Thermal Reversibility of Alkoxyamine in Polymer Solids

7.2 Self‐Healing Cross‐linked Polystyrene

7.2.1 Synthesis

7.2.2 Characterization

7.3 Self‐Healing Epoxy

7.3.1 Synthesis

7.3.2 Characterization

7.4 Self‐Healing Polymers Containing Alkoxyamine with Oxygen Insensitivity and Reduced Homolysis Temperature

7.4.1 Synthesis

7.4.2 Characterization

7.5 Reversible Shape Memory Polyurethane Network with Intrinsic Self‐Healability of Wider Crack

7.5.1 Synthesis

7.5.2 Characterization

7.6 Concluding Remarks

References

8 Intrinsic Self‐Healing Via Exchange Reaction of the Disulfide Bond. CHAPTER MENU

8.1 Room‐Temperature Self‐Healable and Remoldable Cross‐Linked Polysulfide

8.2 Sunlight Driven Self‐Healing Cross‐Linked Polyurethane Containing the Disulfide Bond

8.2.1 Cross‐Linked Polyurethane. 8.2.1.1 Bulk Polymer

8.2.1.2 Composites with Silver Nanowires as Strain Sensor

8.2.2 Commercial Silicone Elastomer

8.3 Self‐Healing and Reclaiming of Vulcanized Rubber

8.4 Concluding Remarks

References

Index. a

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WILEY END USER LICENSE AGREEMENT

Отрывок из книги

Ming Qiu Zhang and Min Zhi Rong

Materials Science Institute, Zhongshan University Guangzhou, China

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It is our intention to emphasize integration of existing techniques and/or inventing novel synthetic approaches for application‐oriented material design and fabrication. Having gone through the book, readers would have a comprehensive knowledge of the field, while new researchers might have an idea of the framework for creating new materials or new applications. Readers from both academic and industrial communities will be provided with a grasp of the achievements to date and an insight into future developments. In addition, graduate students may be able to combine theories learnt in the classroom with practical research and development of materials. These are the goals of this book.

We would like to acknowledge support from the Natural Science Foundation of China (Grants 52 033 011, 51 773 229, 51 673 219, 51 333 008, and 51 873 235). We would also like to thank the team at John Wiley & Sons for their assistance throughout the publication process. In addition, we hope that the publisher is successful with this new book.

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