Читать книгу Substrate-Integrated Millimeter-Wave Antennas for Next-Generation Communication and Radar Systems - Группа авторов - Страница 25

At mmW bands, the integration of antennas and substrate by using a multilayer substrate process are desired for planar or flat design of system boards. The substrate integrated antenna (SIA) can be fabricated exactly as a conventional circuit as for printed circuits on layered boards, where the antennas become part of circuit boards or package of integrated circuits. Such integration greatly reduces the loss caused by the connection between the circuits and the antennas, miniaturizes the size of the system, lowers the fabrication cost, and increases the robustness of the system without additional installation of antennas. The integration of the antennas on the substrate is critically determined by fabrication including the selection of substrate materials and the applicable fabrication process.