Читать книгу Henley's Formulas, Recipes and Processes (Applied Chemistry) - Various - Страница 323
Applications Of Bismuth Amalgams.
Оглавление—The amalgam formed of 1 per cent of bismuth and 4 parts of quicksilver will cause the strong adherence of glass. It is employed with advantage in the tinning of glass globes. For this operation it is poured into a dry hot receiver, and then passed over the whole surface of the glass; it solidifies on cooling. For the purpose of economizing the bismuth, the price of which is high, the preceding amalgam is replaced by another composed of 2 parts of quicksilver, 1 part of bismuth, 1 part of lead, and 1 part of tin. The bismuth, broken into small fragments, is added to the tin and lead, previously melted in the crucible, and when the mixture of the three metals becomes fluid, the quicksilver is poured in, while stirring with an iron rod. The impurities floating on the surface are removed, and when the temperature is sufficiently lowered this amalgam is slowly poured into the vessels to be tinned, which have been previously well cleaned and slightly heated. M. Ditte recommends for the same employment, as a very strong adherent to the glass, an amalgam obtained by dissolving hot 2 parts of bismuth and 1 part of lead in a solution of 1 part of tin in 10 parts of quicksilver. By causing a quantity of this amalgam to move around the inside of a receiver, clean, dry, and slightly heated, the surface will be covered with a thin, brilliant layer, which hardens quite rapidly.
For the injection of anatomical pieces an amalgam formed of 10 parts of quicksilver, 50 parts of bismuth, 31 parts of lead, and 18 parts of tin, fusible at 77.5° and solidifiable at 60° C., is made use of; or, again, an amalgam composed of 9 parts of Darcet alloy and 1 part of quicksilver fusible at 127 1/2° F., and pasty at a still lower temperature. This last amalgam may also be used for filling carious teeth. The Darcet alloy, as known, contains 2 parts of bismuth, 1 part of lead, and 1 part of tin, and melts at 199 1/2° F. The addition of 1 part of quicksilver lowers the fusing point to 104° F.