Читать книгу Microwave Plasma Sources and Methods in Processing Technology - Ladislav Bardos - Страница 4

1  Cover

2  Title page

3  Copyright

4  Foreword from the Authors

5 1 Basic Principles and Components in the Microwave Techniques and Power Systems1.1 History in Brief – From Alternating Current to Electromagnetic Waves and to Microwaves1.2 Microwave Generators1.3 Waveguides and Electromagnetic Modes in Wave Propagation1.3.1 The Cut-off Frequency and the Wavelength in Waveguides1.3.2 Waveguides Filled by Dielectrics1.3.3 Wave Impedance and Standing Waves in Waveguides1.3.4 Coaxial Transmission Lines1.3.5 Microwave Resonators1.4 Waveguide Power Lines1.4.1 Magnetron Tube Microwave Generator1.4.2 Microwave Insulators1.4.3 Impedance Tuners1.4.4 Directional Couplers1.4.5 Passive Waveguide Components – Bends, Flanges, Vacuum Windows1.4.6 Tapered Waveguides and Waveguide Transformers1.4.7 Power Loads and Load Tuners1.4.8 Waveguide Phase Shifters1.4.9 Waveguide Shorting Plungers1.4.10 Coupling from Rectangular to Circular Waveguide: Resonant Cavities for Generation of Plasma1.5 Microwave Oven – A Most Common Microwave Power DeviceReferences

6 2 Gas Discharge Plasmas2.1 Basic Understanding of the Gas Discharge Plasmas2.2 Generation of the Plasma, Townsend Coefficients, Paschen Curve2.3 Generation of the Plasma by AC Power, Plasma Frequency, Cut-off Density2.4 Space-charge Sheaths at Different Frequencies of the Incident Power2.5 Classification of Gas Discharge Plasmas, Effects of Gas Pressure, Microwave Generation of Plasmas2.5.1 Classification of Gas Discharge Plasmas2.5.2 Effects of the Gas Pressure on Particle Collisions in the Plasma2.5.3 Microwave Generation of PlasmasReferences

7 3 Interactions of Plasmas with Solids and Gases3.1 Plasma Processing, PVD, and PE CVD3.2 Sputtering, Evaporation, Dry Etching, Cleaning, and Oxidation of Surfaces3.3 Particle Transport in Plasma Processing and Effects of Gas Pressure3.3.1 Movements of Neutral Particles3.3.2 Movements of Charged Particles3.3 Effect of the Gas Pressure on the Plasma Processing3.4 Afterglow and Decaying Plasma ProcessingReferences

8 4 Microwave Plasma Systems for Plasma Processing at Reduced Pressures4.1 Waveguide-Generated Isotropic and Magnetoactive Microwave Plasmas4.1.1 Waveguide-Generated Isotropic Microwave Oxygen Plasma for Silicon Oxidation4.1.2 ECR and Higher Induction Magnetized Plasma Systems for Silicon Oxidation4.2 PE CVD of Silicon Nitride Films in the Far Afterglow4.3 Microwave Plasma Jets for PE CVD of Films4.3.1 Deposition of Carbon Nitride Films4.3.2 Surfajet Plasma Parameters and an Arrangement for Expanding the Plasma Diameter4.4 Hybrid Microwave Plasma System with Magnetized Hollow CathodeReferences

9 5 Microwave Plasma Systems at Atmospheric and Higher Pressures5.1 Features of the Atmospheric Plasma and Cold Atmospheric Plasma(CAP) Sources5.2 Atmospheric Microwave Plasma Sources Assisted by Hollow Cathodes5.2.1 Applications of the H-HEAD Plasma Source in Surface Treatments5.3 Microwave Treatment of Diesel Exhaust5.4 Microwave Plasma in Liquids5.5 Microwave Plasma Interactions with Flames5.6 Microwave Plasmas at Very High PressuresReferences

10 6 New Applications and Trends in the Microwave PlasmasReferences

11 7 Appendices7.1 List of Symbols and Abbreviations7.2 Constants and Numbers

12  Index

13  End User License Agreement