| 2D | Two‐Dimensional |
| 3D | Three‐Dimensional |
| 3DQCN | Three‐Dimensional Quasi‐Continuous Network |
| AI | Artificial Intelligence |
| AE | Auto‐Encoder |
| Al | Aluminum |
| AL | Absolute Limits |
| ALE | Arbitrary Lagrangian–Eulerian |
| AM | Additive Manufacturing |
| AMCs | Aluminum Matrix Composites |
| AMF | Additive Manufacturing File Format |
| AMGTA | Additive Manufacturer Green Trade Association |
| ANFIS | Adaptive Neuro‐Fuzzy Inference System |
| ANN | Artificial Neural Network |
| ANOVA | Analysis of Variance |
| ANSI | American National Standards Institute |
| APG | Absorptivity Profile Group |
| ASCII | American Standard Code For Information Interchange |
| ASTM | American Society for Testing and Materials |
| BD | Big Data |
| BESO | Bidirectional Evolutionary Structural Optimization |
| BJ | Binder Jetting |
| BJP | Binder Jet Printing |
| BP | Backpropagation |
| BSE | Backscattered Electrons |
| CAD | Computer‐Aided Design |
| CAE | Computer‐Aided Engineering |
| CAGR | Compound Annual Growth Rate |
| CAM | Computer‐Aided Manufacturing |
| CCD | Charged‐coupled device |
| CCT | Continuous Cooling Transformation |
| CDA | Constant Drawing Area |
| CET | Columnar‐to‐Equiaxed Transition |
| CFD | Computational Fluid Dynamics |
| CL | Cathodoluminescence |
| CMOS | Complementary Metal‐Oxide Semiconductor |
| CNC | Computer Numerical Control |
| CNN | Convolutional Neural Network |
| COLIN | Convex Linearization |
| CS | Crack Susceptibility |
| CT | Computed Tomography |
| μCT | micro Computed Tomography |
| CVD | Chemical Vapor Deposition |
| CW | Continuous Wave |
| DAE | Differential‐Algebraic Equation |
| DBN | Deep Belief Network |
| DC | Direct Current |
| DDA | Decreasing Drawing Area |
| DED | Directed Energy Deposition |
| DEM | Discrete/Dynamic Element Model |
| DfAM | Design for AM |
| DfM | Design for Manufacturing |
| DHA | Dust Hazard Analysis |
| DL | Deep Learning |
| DMLS | Direct Metal Laser Sintering |
| DoD | Drop‐on‐Demand |
| DoG | Difference of Gaussian |
| DXF | Drawing Exchange Format |
| EA | Electrical Arc |
| EAM | Embedded‐Atom Method |
| EB | Electron Beam |
| EBAM | Electron Beam Additive Manufacturing |
| EB‐DED | Electron Beam Directed Energy Deposition |
| EBF3 | Electron Beam Freeform Fabrication |
| EBF 3 | Electron Beam Fusion |
| EBM | Electron Beam Melting |
| EB‐PBF | Electron Beam Powder Bed Fusion |
| EDM | Electrical Discharge Machining |
| EIGA | Electrode Induction Melting Inert Gas Atomization |
| EKF | Extended Kafman Filter |
| ELT | Effective Layer Thickness |
| EMFs | Electric and Magnetic Fields |
| ESO | Evolutionary Structural Optimization |
| FBG | Fiber Bragg Gratings |
| FCC | Face Centered Cubic |
| FCM | Finite Cell Method |
| FDM | Fused Deposition Modeling |
| FE | Finite Element |
| FEA | Finite Element Analysis |
| FEG | Field‐Emission Gun |
| FEM | Finite Element Method |
| FFT | Fast Fourier Transformation |
| FGM | Functionally Graded Material |
| FGSs | Functionally Graded Structures |
| FIS | Fuzzy Inference System |
| FMC | Ford Motor Company |
| FN | False Negative |
| FP | False Positive |
| FS | Free Surface |
| GD | Gradient Descent |
| GM | General Motors |
| GMG | Geometrically Modified Group |
| GP | Gaussian Process |
| HA | Hydroxyapatite |
| HAZ | Heat‐Affected Zone |
| HDR | Heating Depth Ratio |
| HF | Highly Filled |
| HIP | Hot Isostatic Pressing |
| HPM | Heaviside Projection Method |
| ICI | Inline Coherent Imaging |
| IDAM | Industrialization and Digitization of Additive Manufacturing |
| IDT | Interdigitated Transducers |
| IN | Inconel |
| IoT | Internet of Things |
| ISO | International Standards Organization |
| ISO | International Standards Organization |
| KF | Kafman Filter |
| KNN | K‐nearest neighbors |
| LaB 6 | Lanthanum Hexaboride |
| LBM | Lattice–Boltzmann Method |
| LCA | Life Cycle Assessment |
| LCF | Low Cycle Fatigue |
| LDED | Laser Directed Energy Deposition |
| LENS | Laser Engineered Net Shaping |
| LGA | Lattice Gas Automata |
| LM | Levenberg–Marquardt |
| LN | Large Negative |
| LoF | Lack of Fusion |
| LP | Large Positive |
| LPBF | Laser Powder Bed Fusion |
| LPM | Laser Power Monitoring |
| LSF | Level Set Functions |
| LSM | Level Set Method |
| LWIR | Long Wave Infrared |
| MAPE | Mean Absolute Prediction Error |
| MC | Metal Carbide |
| MD | Molecular Dynamics |
| ME | Material Extrusion |
| MG | Metallic Glass |
| MJ | Material Jetting |
| MMA | Method of Moving Asymptotes |
| MMCs | Metal Matrix Composites |
| MME | Metal Material Extrusion |
| MMP | Micro‐Machining Process |
| MMV | Moving Morphable Voids |
| MOV | Main Oxidizer Valve |
| MPC | Metal–Polymer Composite |
| MPE | Maximum Permissible Exposure |
| MPM | Melt Pool Monitoring |
| MS | Multi‐Speed |
| MSDS | Material Safety Data Sheet |
| MSE | Mean Squared Error |
| MTPS | Multifunctional Thermal Protection System |
| Nd | Neodymium |
| NDT | Non‐Destructive Testing |
| NFPA | National Fire Protection Association |
| nHA | Nano‐Hydroxyapatite |
| NHZ | Nominal Hazard Zone |
| Ni | Nickle |
| NIR | Near‐Infrared |
| NIST | National Institute of Standards and Technology |
| NN | Neural Network |
| NS | Navier–Stokes |
| OCM | Optimality Criterial Method |
| OCT | Optical Coherence Tomography |
| OEM | Original Equipment Manufacturers |
| OPD | Optical Penetration Depth |
| OTLs | Orthogonal Translational Lattices |
| PBF | Powder Bed Fusion |
| PCA | Principal Component Analysis |
| PDF | Point Distribution Function |
| PF | Powder‐Fed |
| PI | Proportional–Integral |
| PID | Proportional–Integral–Derivative |
| PMC | Polymer Matrix Composite |
| PMZ | Partially Melted Zone |
| PPE | Personal Protective Equipment |
| PPHT | Post‐Processing Heat Treatment |
| PREP | Plasma Rotate Electrode Process |
| PSD | Particle Size Distribution |
| PTA‐DED | Plasma Transferred Arc Directed Energy Deposition |
| PVD | Physical Vapor Deposition |
| PW | Pulsed Wave |
| PZT | Piezoelectric |
| R&D | Research and development |
| RAMP | Rational Approximation of Material Properties |
| RDM | Relative Density Mapping |
| REP | Rotating Electrode Process |
| RF | Radio Frequency |
| RGB | Red‐Green‐Blue |
| RLS | Recursive Least Square |
| RMSE | Root Mean Square Error |
| RNN | Recurrent Neural Networks |
| ROS | Reactive Oxygen Species |
| RTE | Radiation Transfer Equation |
| SAW | Surface Acoustic Wave |
| SD | Signal Dynamics |
| SDAS | Secondary Dendritic Arm Spacing |
| SE | Secondary Electrons |
| SIMP | Solid Isotropic Material with Penalization |
| SINH | Sine Hyperbolic Function |
| SL | Sheet Lamination |
| SLD | Super‐Luminescent Diode |
| SLD‐OCT | Super‐Luminescent Diode—Optical Coherence Tomography |
| SLM | Selective Laser Melting |
| SLP | Sequential Linear Programming |
| SLR | Single‐Lens Reflex |
| SLS | Selective Laser Sintering |
| SN | Small Negative |
| SOM | Self‐Organizing Map |
| SP | Small Positive |
| SQP | Sequential Quadratic Programming |
| SRAS | Spatially Resolved Acoustic Spectroscopy |
| STF | Short‐Term Fluctuations |
| STL | Standard Tessellation Language or StereoLithography |
| STP | Standard for the Product Data |
| ST‐PCA | Spatially Weighted Principal Component Analysis |
| SVD | Singular Value Decomposition |
| SVM | Support Vector Machine |
| TCP | Topological Close‐Packed |
| TEM | Transverse Electromagnetic Modes |
| TGM | Temperature Gradient Mechanism |
| Ti | Titanium |
| TiC | Titanium Carbide |
| Ti‐HA | Titanium‐Hydroxyapatite |
| TMCs | Titanium‐Matrix Composites |
| TN | True Negative |
| TP | True Positive |
| TPMS | Triply Periodic Minimal Surface |
| TRL | Technology Readiness Level |
| TTT | Transformation Time Temperature |
| VC | Vanadium Carbides |
| VED | Volumetric Energy Density |
| VoF | Volume‐of‐Fluid |
| VTM | Virtual Temperature Method |
| WF | Wire‐Fed |
| WF‐EDED | Wire‐Fed Electron Beam Directed Energy Deposition |
| XRD | X‐Ray Diffraction |
| XRF | X‐Ray Fluorescence |
| YAG | Yttrium Aluminum Garnet |
| YLF | Yttrium Lithium Fluoride |
| YVO4 | Yttrium Orthovanadate |
