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1 1 Chen, K.‐N. and Tu, K.N. (2015). Materials challenges in three‐dimensional integrated circuits. MRS Bulletin 40: 219–222.

2 2 Iyer, S. (2015). Three‐dimensional integration: an industry perspective. MRS Bulletin 40: 225–232.

3 3 Chen, C., Yu, D., and Chen, K.‐N. (2015). Vertical interconnects of microbumps in 3D integration. MRS Bulletin 40: 257–263.

4 4 Prigogine, I. (1967). Introduction to Thermodynamics of Irreversible Processes, 3e. New York: Wiley‐Interscience.

5 5 Tu, K.N. (2011). Chapter 10 on “Irreversible processes in interconnect and packaging technology”. In: Electronic Thin‐Film Reliability (ed. K.N. Tu). Cambridge, UK: Cambridge University Press.

6 6 Tu, K.N., Liu, Y., and Li, M. (2017). Effect of Joule heating and current crowding on electromigration in mobile technology. Applied Physics Reviews 4: 011101.

7 7 Tu, K.N. and Gusak, A.M. (2019). A unified model of mean‐time‐to‐failure for electromigration, thermomigration, and stress‐migration based on entropy production. Journal of Applied Physics 126: 075109.