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1 Chapter 1Table 1.1 5G technical requirements.

2 Chapter 2Table 2.1 Cu surface diffusivity (cm²/sec).

3 Chapter 6Table 6.1 Ideal scaling of MOS transistors.Table 6.2 Scaling of local and global interconnections.Table 6.3 Intel’s P856 Interconnect dimensions (0.25 um process).

4 Chapter 10Table 10.1 Comparison between atomic flux and electron flux.Table 10.2 Diffusivity at 100 °C.