APC | Advanced Process Control |
ATP | Available‐to‐Promise |
AVM | Automatic Virtual Metrology |
BDA | Big Data Analytics |
CASD | Capacity‐Allocated‐Support Demand |
CIM | Computer‐Integrated Manufacturing |
CMfg | Cloud‐based Manufacturing |
CORBA | Common Object Request Broker Architecture |
CPS | Cyber‐Physical Systems |
EC | Engineering Chain |
ECMS | Engineering‐Chain‐Management System |
EECs | Equipment Engineering Capabilities |
EE | Equipment Engineering |
EES | Equipment Engineering System |
EPS | Equipment Prognosis System |
ERP | Enterprise Resource Planning |
ESCM | Electronic Supply Chain Management |
FDC | Fault Detection and Classification |
FOUP | Front Opening Unified Pod |
FICS | Free Internet Chess Server |
GEDs | Generic Embedded Devices |
GEM | Generic Equipment Model |
GH | Generic Holon |
GUI | Graphical User Interface |
HMES | Holonic Manufacturing Execution System |
HSCS | Holonic Supply‐Chain System |
HSMS | High‐Speed SECS Message Services |
IC | Integrated Circuit |
ICT | Information and Communication Technology |
iFA | Intelligent Factory Automation |
IoT | Internet of Things |
IP | Internet Protocol Address |
IPM | Intelligent Predictive Maintenance |
ISMT | International SEMATECH |
IT | Information Technology |
ITRS | International Technology Roadmap of Semiconductor |
IYM | Intelligent Yield Management |
KSA | Key‐variable Search Algorithm |
L2L | Lot‐to‐Lot |
MC | Mass Customization |
MCS | Material Control System |
MES | Manufacturing Execution System |
MP | Mass Production |
MPS | Master Production Schedule |
NACFAM | National Coalition for Advanced Manufacturing |
O2D | Order‐to‐Delivery |
OEE | Overall Equipment Effectiveness |
PdM | Predictive Maintenance |
PO | Purchase Order |
R2R | Run‐to‐Run |
RD | Research and Development |
RDL | Re‐Distribution Layer |
RM | Recipe Management |
RUL | Remaining Useful Life |
SC | Supply Chain |
SECS | SEMI Equipment Communications Standard |
SOAP | Simple Object Access Protocol |
SPC | Statistical Process Control |
SSL | Secure Sockets Layer |
T2M | Time‐to‐Market |
tsmc | Taiwan Semiconductor Manufacturing Company |
UBM | Under Bump Metallurgy |
VM | Virtual Metrology |
W2W | Wafer‐to‐Wafer |
W2W | Workpiece‐to‐Workpiece |
WIP | Work in Process |
WSDL | Web Services Description Language |
YES | Yield Enhancement System |
YMS | Yield Management System |
ZD | Zero Defects |