Читать книгу Antenna-in-Package Technology and Applications - Duixian Liu - Страница 2
Table of Contents
Оглавление1 Cover
3 Preface
5 1 Introduction 1.1 Background 1.2 The Idea 1.3 Exploring the Idea 1.4 Developing the Idea into a Mainstream Technology 1.5 Concluding Remarks Acknowledgements References
6 2 Antennas 2.1 Introduction 2.2 Basic Antennas 2.3 Unusual Antennas 2.4 Microstrip Patch Antennas 2.5 Microstrip Grid Array Antennas 2.6 Yagi‐Uda Antennas 2.7 Magneto‐Electric Dipole Antennas 2.8 Performance Improvement Techniques 2.9 Summary Acknowledgements References
7 3 Packaging Technologies 3.1 Introduction 3.2 Major Packaging Milestones 3.3 Packaging Taxonomy 3.4 Packaging Process for Several Major Packages 3.5 Summary and Emerging Trends References
8 4 Electrical, Mechanical, and Thermal Co‐Design 4.1 Introduction 4.2 Electrical, Warpage, and Thermomechanical Analysis for AiP Co‐design 4.3 Thermal Management Considerations for Next‐generation Heterogeneous Integrated Systems Acknowledgment References
9 5 Antenna‐in‐Package Measurements 5.1 General Introduction and Antenna Parameters 5.2 Impedance Measurements 5.3 Anechoic Measurement Facility for Characterizing AiPs 5.4 Over‐the‐air System‐level Testing 5.5 Summary and Conclusions References Note
10 6 Antenna‐in‐package Designs in Multilayered Low‐temperature Co‐fired Ceramic Platforms 6.1 Introduction 6.2 LTCC Technology 6.3 LTCC‐based AiP 6.4 Challenges and Upcoming Trends in LTCC AiP References
11 7 Antenna Integration in Packaging Technology operating from 60 GHz up to 300 GHz (HDI‐based AiP) 7.1 Organic Packaging Technology for AiP 7.2 Integration of AiP in Organic Packaging Technology Below 100 GHz 7.3 Integration of AiP in Organic Packaging Technology in the 120–140‐GHz Band 7.4 Integration of AiP in Organic Packaging Technology Beyond 200 GHz 7.5 Conclusion and Perspectives References
12 8 Antenna Integration in eWLB Package 8.1 Introduction 8.2 The Embedded Wafer Level BGA Package 8.3 Toolbox Elements for AiP in eWLB 8.4 Antenna Integration in eWLB 8.5 Application Examples 8.6 Conclusion Acknowledgement References NOTE
13 9 Additive Manufacturing AiP Designs and Applications 9.1 Introduction 9.2 Additive Manufacturing Technologies 9.3 Material Characterization 9.4 Recent Advances in AM for Packaging 9.5 Fabrication Process 9.6 AiP and SoP using AM Technologies 9.7 Summary and Prospect References
14 10 SLC‐based AiP for Phased Array Applications 10.1 Introduction 10.2 SLC Technology 10.3 AiP for 5G Base Station Applications 10.4 94‐GHz Scalable AiP Phased‐array Applications Acknowledgment References
15 11 3D AiP for Power Transfer, Sensor Nodes, and IoT Applications 11.1 Introduction 11.2 Small Antenna Design and Miniaturization Techniques 11.3 Multi‐mode Capability: A Way to Achieve Wideband Antennas 11.4 Miniaturized Antenna Solutions for Power Transfer and Energy Harvesting Applications 11.5 AiP Solutions in Low‐cost PCB Technology References
16 Index
