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1.5 Concluding Remarks

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AiP technology has broken the boundaries between antenna and circuit fields. The methodology and platform to co‐design antenna and circuits is now available. AiP technology has justified developing new materials and processes, which is rare, to the best of my knowledge, and only microstrip patch antennas have received such attention. Testing has to be considered along the whole manufacturing cycle, including test strategies, verification and characterization, production testing, integration and system level testing. Probe‐based measurement setups are suitable for AiP design verification and characterization. OTA antenna measurements are required for production testing, integration and system level testing. In the future, AiP technology will continue to provide direct antenna solutions to highly integrated wireless systems that will operate at even higher mmWave frequencies. It will also provide parasitic or distributive radiator functions to enhance the terahertz antenna performance of AoC technology.

Antenna-in-Package Technology and Applications

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